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Industries
X-ray and CT inspection for electronics
BliXray X-ray and CT systems inspect solder joints and chip structures that lie hidden under the component. 2D X-ray gives the fast overview, CT separates the layers of a densely populated board.
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Flat parts need their own scan geometry
A circuit board is wide and thin. Planar CT keeps the source close to the board and still delivers layer images, where a conventional CT would need a much larger distance.
In the laboratory and in the line
Laboratory systems serve failure analysis and process set-up. Inline systems with automatic loading and evaluation inspect every board in production.
Typical parts
- Printed circuit board assemblies
- BGA and other area-array packages
- Connectors and cable assemblies
- Power modules and their solder layers
- Sensors and encapsulated assemblies
Matching machines.
Nanofocus laboratory CT BLCT-NANOLAB
- Open nanofocus source up to 190 kV
- 3D resolution down to 1 µm
- Samples up to 150 × 150 × 150 mm and 5 kg
- X-ray sources up to 300 kV, optional dual source
- 3D resolution 3 µm
- Parts up to 600 × 600 × 800 mm and 100 kg
Planar CT, 2D X-ray and laminography systems for boards and flat assemblies are listed under further systems. Further systems →